關于我司提供的 SOD123FL/SMA/SMB/SMC 封裝產品，由于兩片夾焊的方式無法避免應力的釋放，為提升產品整體可靠性，將會推出三片式焊接工藝. 附圖 1-1
Regarding the SOD123FL/SMA/SMB/SMC package products provided by our company, as the two-piece clamp soldering methodcannot avoid the release of stress, in order to improve the overall reliability of the product, three-piece soldering will be launched. Attachment 1-1
我們繼續(xù)承諾：我們的產品電性性能保持不變，符合我們的 Data Sheet，同時增加其產品在受到溫度濕度變化后抗應力能力，提升其可靠性。如果貴司涉及需要 PCN 申請，請及時聯系我們銷售人員。我們將按照要求來提交，如果在 2024/11/15 日之前未提出需求，
我們將切換更可靠性的 CLIP 工藝的產品。
We continue to promise: The electrical parameters of our products remain the same, in line with our Data Sheet, while increasing the
stress resistance of their products to changes in high temperature and humidity, improving their reliability. If your company needs
PCN application, please contact our sales staff in time. We will submit according to the requirements. If there is no demand before
2024/11/15, we will ship to the more reliable CLIP process products.
感謝貴司對于MDD的一路既往的支持和信任！
Thank you for your support and trust in MDD all the way!
